Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2004 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 13.5MOhm |
Subcategory | Other Transistors |
Voltage - Rated DC | -30V |
Technology | MOSFET (Metal Oxide) |
Current Rating | -11A |
Number of Elements | 1 |
Row Spacing | 6.3 mm |
Number of Channels | 1 |
Power Dissipation-Max | 2.5W Ta |
Element Configuration | Single |
Power Dissipation | 2.5W |
Turn On Delay Time | 15 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 13.5m Ω @ 11A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 4030pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 11A Ta |
Gate Charge (Qg) (Max) @ Vgs | 110nC @ 10V |
Rise Time | 23ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Forward Voltage | -1.2V |
Fall Time (Typ) | 76 ns |
Turn-Off Delay Time | 150 ns |
Continuous Drain Current (ID) | -11A |
Threshold Voltage | -2.5V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | -30V |
Dual Supply Voltage | -30V |
Recovery Time | 60 ns |
Max Junction Temperature (Tj) | 150°C |
Nominal Vgs | -2.5 V |
Height | 1.75mm |
Length | 4.9784mm |
Width | 4.05mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |