Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Surface Mount | YES |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tube |
Published | 2001 |
Series | HEXFET® |
JESD-609 Code | e0 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | TIN LEAD |
Additional Feature | AVALANCHE RATED |
HTS Code | 8541.29.00.95 |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 245 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PDSO-G8 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.5W Ta |
Operating Mode | ENHANCEMENT MODE |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 170m Ω @ 1.5A, 10V |
Vgs(th) (Max) @ Id | 5.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 940pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 2.5A Ta |
Gate Charge (Qg) (Max) @ Vgs | 39nC @ 10V |
Drain to Source Voltage (Vdss) | 200V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±30V |
JEDEC-95 Code | MS-012AA |
Drain Current-Max (Abs) (ID) | 2.5A |
Drain-source On Resistance-Max | 0.17Ohm |
Pulsed Drain Current-Max (IDM) | 20A |
DS Breakdown Voltage-Min | 200V |
Avalanche Energy Rating (Eas) | 230 mJ |
RoHS Status | Non-RoHS Compliant |