Parameters | |
---|---|
Fall Time (Typ) | 58 ns |
Series | HEXFET®, StrongIRFET™ |
Turn-Off Delay Time | 68 ns |
Part Status | Active |
Continuous Drain Current (ID) | 217A |
Gate to Source Voltage (Vgs) | 20V |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Pulsed Drain Current-Max (IDM) | 868A |
Number of Terminations | 6 |
DS Breakdown Voltage-Min | 40V |
ECCN Code | EAR99 |
Avalanche Energy Rating (Eas) | 206 mJ |
RoHS Status | ROHS3 Compliant |
Technology | MOSFET (Metal Oxide) |
Lead Free | Lead Free |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-N6 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 96W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 21 ns |
FET Type | N-Channel |
Factory Lead Time | 1 Week |
Transistor Application | SWITCHING |
Mount | Surface Mount |
Rds On (Max) @ Id, Vgs | 1.2m Ω @ 132A, 10V |
Mounting Type | Surface Mount |
Vgs(th) (Max) @ Id | 3.9V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 6680pF @ 25V |
Package / Case | DirectFET™ Isometric ME |
Number of Pins | 10 |
Current - Continuous Drain (Id) @ 25°C | 217A Tc |
Transistor Element Material | SILICON |
Gate Charge (Qg) (Max) @ Vgs | 185nC @ 10V |
Operating Temperature | -55°C~150°C TJ |
Rise Time | 70ns |
Packaging | Tape & Reel (TR) |
Drain to Source Voltage (Vdss) | 40V |
Drive Voltage (Max Rds On,Min Rds On) | 6V 10V |
Vgs (Max) | ±20V |
Published | 2007 |