Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1997 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Resistance | 135mOhm |
Additional Feature | ULTRA LOW RESISTANCE |
Voltage - Rated DC | 30V |
Max Power Dissipation | 1.25W |
Terminal Form | GULL WING |
Current Rating | 2.4A |
Base Part Number | IRF7503PBF |
Number of Elements | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.25W |
Turn On Delay Time | 4.7 ns |
FET Type | 2 N-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 135m Ω @ 1.7A, 10V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 210pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 10V |
Rise Time | 10ns |
Fall Time (Typ) | 5.3 ns |
Turn-Off Delay Time | 12 ns |
Continuous Drain Current (ID) | 2.4A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 14A |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Nominal Vgs | 1 V |
Height | 860μm |
Length | 3mm |
Width | 3mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |