Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1998 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Resistance | 270mOhm |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | ULTRA LOW RESISTANCE |
Max Power Dissipation | 1.25W |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | IRF7507PBF |
Number of Elements | 2 |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.25W |
FET Type | N and P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 140m Ω @ 1.7A, 4.5V |
Vgs(th) (Max) @ Id | 700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 260pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 2.4A 1.7A |
Gate Charge (Qg) (Max) @ Vgs | 8nC @ 4.5V |
Polarity/Channel Type | N-CHANNEL AND P-CHANNEL |
Turn-Off Delay Time | 38 ns |
Continuous Drain Current (ID) | 2.4A |
Threshold Voltage | 700mV |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | 20V |
Pulsed Drain Current-Max (IDM) | 19A |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Nominal Vgs | 700 mV |
Height | 860μm |
Length | 3mm |
Width | 3mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |