Parameters | |
---|---|
Resistance | 25MOhm |
Voltage - Rated DC | 30V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | 6.6A |
Number of Elements | 1 |
Row Spacing | 6.3 mm |
Power Dissipation-Max | 2.5W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Turn On Delay Time | 12 ns |
Mount | Surface Mount |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 25m Ω @ 7A, 4.5V |
Mounting Type | Surface Mount |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Current - Continuous Drain (Id) @ 25°C | 8.3A Ta |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 5V |
Rise Time | 17ns |
Number of Pins | 8 |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V |
Vgs (Max) | ±12V |
Transistor Element Material | SILICON |
Fall Time (Typ) | 6 ns |
Operating Temperature | -55°C~150°C TJ |
Turn-Off Delay Time | 25 ns |
Continuous Drain Current (ID) | 8.3A |
Threshold Voltage | 1V |
Packaging | Tube |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 66A |
Published | 2004 |
Dual Supply Voltage | 30V |
Nominal Vgs | 1 V |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 3.9878mm |
Series | HEXFET® |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Contains Lead, Lead Free |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |