Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2003 |
Series | HEXFET® |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Resistance | 25MOhm |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 30V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 8.3A |
Number of Elements | 1 |
Configuration | Single |
Power Dissipation-Max | 2.5W Ta |
Power Dissipation | 2.5W |
Turn On Delay Time | 6.3 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 25m Ω @ 7A, 4.5V |
Vgs(th) (Max) @ Id | 3V @ 250μA |
Current - Continuous Drain (Id) @ 25°C | 8.3A Ta |
Gate Charge (Qg) (Max) @ Vgs | 14nC @ 5V |
Rise Time | 1.2ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 2.2 ns |
Turn-Off Delay Time | 11 ns |
Continuous Drain Current (ID) | 8.3A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 3.9878mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |