Parameters | |
---|---|
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Vgs (Max) | ±20V |
Fall Time (Typ) | 12 ns |
Transistor Element Material | SILICON |
Turn-Off Delay Time | 14 ns |
Operating Temperature | -55°C~150°C TJ |
Continuous Drain Current (ID) | 3.7A |
Packaging | Tape & Reel (TR) |
Threshold Voltage | 4V |
Published | 2012 |
Gate to Source Voltage (Vgs) | 20V |
DS Breakdown Voltage-Min | 200V |
Series | HEXFET® |
Part Status | Active |
Nominal Vgs | 4 V |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Radiation Hardening | No |
REACH SVHC | No SVHC |
Number of Terminations | 8 |
RoHS Status | ROHS3 Compliant |
ECCN Code | EAR99 |
Lead Free | Lead Free |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.5W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Turn On Delay Time | 7.1 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 78m Ω @ 2.2A, 10V |
Vgs(th) (Max) @ Id | 5V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 1750pF @ 100V |
Current - Continuous Drain (Id) @ 25°C | 3.7A Ta |
Factory Lead Time | 1 Week |
Gate Charge (Qg) (Max) @ Vgs | 44nC @ 10V |
Mount | Surface Mount |
Rise Time | 3.2ns |
Mounting Type | Surface Mount |
Drain to Source Voltage (Vdss) | 200V |