Parameters | |
---|---|
Rds On (Max) @ Id, Vgs | 13.4m Ω @ 10A, 10V |
Vgs(th) (Max) @ Id | 4.9V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 1620pF @ 25V |
Factory Lead Time | 1 Week |
Current - Continuous Drain (Id) @ 25°C | 10A Ta |
Mount | Surface Mount |
Gate Charge (Qg) (Max) @ Vgs | 41nC @ 10V |
Mounting Type | Surface Mount |
Rise Time | 8.5ns |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Vgs (Max) | ±20V |
Operating Temperature | -55°C~150°C TJ |
Fall Time (Typ) | 8.6 ns |
Packaging | Tape & Reel (TR) |
Published | 2006 |
Turn-Off Delay Time | 15 ns |
Series | HEXFET® |
JESD-609 Code | e3 |
Continuous Drain Current (ID) | 10A |
Part Status | Active |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 80V |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Pulsed Drain Current-Max (IDM) | 79A |
Height | 1.4986mm |
Number of Terminations | 8 |
Length | 4.9784mm |
ECCN Code | EAR99 |
Width | 3.9878mm |
Radiation Hardening | No |
Terminal Finish | MATTE TIN |
RoHS Status | ROHS3 Compliant |
Subcategory | FET General Purpose Power |
Lead Free | Lead Free |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.5W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Turn On Delay Time | 9.4 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |