Parameters | |
---|---|
Power Dissipation-Max | 2.8W Ta 100W Tc |
Power Dissipation | 100W |
Turn On Delay Time | 16 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 2.2mOhm @ 28A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 4700pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 28A Ta 170A Tc |
Gate Charge (Qg) (Max) @ Vgs | 42nC @ 4.5V |
Rise Time | 22ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 13 ns |
Turn-Off Delay Time | 19 ns |
Continuous Drain Current (ID) | 28A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Input Capacitance | 4.7nF |
Drain to Source Resistance | 3.2mOhm |
Rds On Max | 2.2 mΩ |
Nominal Vgs | 1.8 V |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MX |
Number of Pins | 7 |
Supplier Device Package | DIRECTFET™ MX |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Technology | MOSFET (Metal Oxide) |