Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric MX |
Number of Pins | 7 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
JESD-30 Code | R-XBCC-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.1W Ta 113W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.1W |
Case Connection | DRAIN |
Turn On Delay Time | 29 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 2.9m Ω @ 22A, 10V |
Vgs(th) (Max) @ Id | 2.4V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 7305pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 22A Ta 160A Tc |
Gate Charge (Qg) (Max) @ Vgs | 130nC @ 10V |
Rise Time | 160ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 110 ns |
Turn-Off Delay Time | 115 ns |
Continuous Drain Current (ID) | 22A |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.0029Ohm |
Drain to Source Breakdown Voltage | -30V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |