Parameters | |
---|---|
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-220-3 |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~175°C TJ |
Packaging | Tube |
Published | 2008 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | Through Hole |
ECCN Code | EAR99 |
Resistance | 33MOhm |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 250V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 60A |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 390W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 390W |
Case Connection | DRAIN |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 33m Ω @ 35A, 10V |
Vgs(th) (Max) @ Id | 5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 5860pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 60A Tc |
Gate Charge (Qg) (Max) @ Vgs | 150nC @ 10V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±30V |
Continuous Drain Current (ID) | 60A |
Threshold Voltage | 5V |
JEDEC-95 Code | TO-220AB |
Gate to Source Voltage (Vgs) | 30V |
Drain to Source Breakdown Voltage | 250V |
Dual Supply Voltage | 250V |
Recovery Time | 290 ns |
Max Junction Temperature (Tj) | 175°C |
Nominal Vgs | 5 V |
Height | 19.8mm |
Length | 10.66mm |
Width | 4.82mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |