Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-273AA |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~175°C TJ |
Packaging | Tube |
Published | 2004 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Resistance | 3.7MOhm |
Additional Feature | AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 40V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 206A |
Number of Elements | 1 |
Power Dissipation-Max | 300W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 300W |
Case Connection | DRAIN |
Turn On Delay Time | 17 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.7m Ω @ 95A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 7360pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 206A Tc |
Gate Charge (Qg) (Max) @ Vgs | 200nC @ 10V |
Rise Time | 140ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 26 ns |
Turn-Off Delay Time | 72 ns |
Continuous Drain Current (ID) | 206A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 95A |
Drain to Source Breakdown Voltage | 40V |
Pulsed Drain Current-Max (IDM) | 650A |
Avalanche Energy Rating (Eas) | 480 mJ |
Height | 15mm |
Length | 10.9982mm |
Width | 5mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |