Parameters | |
---|---|
Radiation Hardening | No |
Max Operating Temperature | 175°C |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Min Operating Temperature | -55°C |
Technology | MOSFET (Metal Oxide) |
Lead Pitch | 2.54mm |
Number of Elements | 1 |
Row Spacing | 7.62 mm |
Power Dissipation-Max | 1.3W Ta |
Element Configuration | Single |
Power Dissipation | 1.3W |
Turn On Delay Time | 11 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 500mOhm @ 660mA, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 270pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 1.1A Ta |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 10V |
Rise Time | 63ns |
Drain to Source Voltage (Vdss) | 60V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 63 ns |
Turn-Off Delay Time | 10 ns |
Factory Lead Time | 1 Week |
Continuous Drain Current (ID) | 1.1A |
Mount | Through Hole |
Threshold Voltage | -4V |
Mounting Type | Through Hole |
Gate to Source Voltage (Vgs) | 20V |
Package / Case | 4-DIP (0.300, 7.62mm) |
Number of Pins | 4 |
Drain to Source Breakdown Voltage | 60V |
Dual Supply Voltage | -60V |
Supplier Device Package | 4-DIP, Hexdip, HVMDIP |
Input Capacitance | 270pF |
Drain to Source Resistance | 500mOhm |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Rds On Max | 500 mΩ |
Published | 2005 |
Nominal Vgs | -4 V |
Height | 3.3782mm |
Part Status | Active |
Length | 6.2738mm |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Width | 5.0038mm |
Resistance | 500mOhm |