Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerVDFN |
Number of Pins | 8 |
Supplier Device Package | 8-PQFN (3x3) |
Packaging | Cut Tape (CT) |
Published | 2010 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Resistance | 7.1MOhm |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 2.8W |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Element Configuration | Single |
Power Dissipation | 2.8W |
Turn On Delay Time | 9.6 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 7.1mOhm @ 16A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds | 1510pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 16A Ta 42A Tc |
Gate Charge (Qg) (Max) @ Vgs | 14nC @ 4.5V |
Rise Time | 15ns |
Drain to Source Voltage (Vdss) | 30V |
Fall Time (Typ) | 5.8 ns |
Turn-Off Delay Time | 11 ns |
Continuous Drain Current (ID) | 16A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Input Capacitance | 1.51nF |
Recovery Time | 26 ns |
Drain to Source Resistance | 7.1mOhm |
Rds On Max | 7.1 mΩ |
Nominal Vgs | 1.8 V |
Height | 939.8μm |
Length | 2.9972mm |
Width | 2.9972mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |