Parameters | |
---|---|
Input Capacitance (Ciss) (Max) @ Vds | 755pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 12A Ta 29A Tc |
Gate Charge (Qg) (Max) @ Vgs | 8.1nC @ 4.5V |
Rise Time | 10.2ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 9.7 ns |
Turn-Off Delay Time | 8.7 ns |
Continuous Drain Current (ID) | 12mA |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Factory Lead Time | 1 Week |
Drain Current-Max (Abs) (ID) | 12A |
Mount | Surface Mount |
Drain to Source Breakdown Voltage | 30V |
Mounting Type | Surface Mount |
Pulsed Drain Current-Max (IDM) | 96A |
Avalanche Energy Rating (Eas) | 13 mJ |
Package / Case | 8-PowerVDFN |
Nominal Vgs | 1.8 V |
Number of Pins | 8 |
Height | 950μm |
Length | 3mm |
Transistor Element Material | SILICON |
Width | 3mm |
Operating Temperature | -55°C~150°C TJ |
Radiation Hardening | No |
Packaging | Tape & Reel (TR) |
REACH SVHC | No SVHC |
Published | 2010 |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Resistance | 12.4MOhm |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
JESD-30 Code | S-PDSO-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.8W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.8W |
Case Connection | DRAIN |
Turn On Delay Time | 7.8 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 12.4m Ω @ 12A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 25μA |