Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerVDFN |
Number of Pins | 8 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET® |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Max Power Dissipation | 50W |
Number of Elements | 2 |
Element Configuration | Dual |
Power - Max | 31W 50W |
FET Type | 2 N-Channel (Dual) |
Rds On (Max) @ Id, Vgs | 3.2m Ω @ 30A, 10V |
Vgs(th) (Max) @ Id | 2.1V @ 35μA |
Input Capacitance (Ciss) (Max) @ Vds | 1314pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 64A 145A |
Gate Charge (Qg) (Max) @ Vgs | 15nC @ 4.5V |
Drain to Source Voltage (Vdss) | 25V |
Continuous Drain Current (ID) | 145A |
Threshold Voltage | 1.6V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 35A |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Height | 900μm |
Length | 6mm |
Width | 5mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |