Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Supplier Device Package | 8-PQFN (5x6) |
Packaging | Cut Tape (CT) |
Published | 2010 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 3.6W |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Element Configuration | Single |
Power Dissipation | 3.6W |
Turn On Delay Time | 9.6 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 4.1mOhm @ 50A, 10V |
Vgs(th) (Max) @ Id | 4V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 4175pF @ 30V |
Current - Continuous Drain (Id) @ 25°C | 21A Ta 100A Tc |
Gate Charge (Qg) (Max) @ Vgs | 100nC @ 10V |
Rise Time | 13ns |
Drain to Source Voltage (Vdss) | 60V |
Fall Time (Typ) | 12 ns |
Turn-Off Delay Time | 30 ns |
Continuous Drain Current (ID) | 100A |
Threshold Voltage | 4V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 60V |
Input Capacitance | 4.175nF |
Recovery Time | 42 ns |
Drain to Source Resistance | 4.1mOhm |
Rds On Max | 4.1 mΩ |
Nominal Vgs | 4 V |
Height | 990.6μm |
Length | 6.1468mm |
Width | 5.15mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |