Parameters | |
---|---|
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PDSO-N5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 3.6W Ta 156W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3.6W |
Case Connection | DRAIN |
Turn On Delay Time | 9.4 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 31m Ω @ 34A, 10V |
Vgs(th) (Max) @ Id | 5V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 2300pF @ 50V |
Current - Continuous Drain (Id) @ 25°C | 10A Ta 56A Tc |
Gate Charge (Qg) (Max) @ Vgs | 50nC @ 10V |
Rise Time | 9.7ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 3.4 ns |
Turn-Off Delay Time | 14 ns |
Continuous Drain Current (ID) | 56A |
Threshold Voltage | 5V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 150V |
Pulsed Drain Current-Max (IDM) | 220A |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Avalanche Energy Rating (Eas) | 230 mJ |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Max Junction Temperature (Tj) | 150°C |
Number of Pins | 8 |
Height | 900μm |
Transistor Element Material | SILICON |
Length | 6.1468mm |
Operating Temperature | -55°C~150°C TJ |
Width | 5.15mm |
Packaging | Tape & Reel (TR) |
Radiation Hardening | No |
Published | 2011 |
Series | HEXFET® |
REACH SVHC | No SVHC |
JESD-609 Code | e3 |
RoHS Status | ROHS3 Compliant |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free | Lead Free |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |