Parameters | |
---|---|
Vgs(th) (Max) @ Id | 2.35V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 4400pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 32A Ta 100A Tc |
Gate Charge (Qg) (Max) @ Vgs | 76nC @ 10V |
Rise Time | 51ns |
Drain to Source Voltage (Vdss) | 30V |
Fall Time (Typ) | 18 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 100A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Input Capacitance | 4.4nF |
Recovery Time | 29 ns |
Drain to Source Resistance | 2.1mOhm |
Rds On Max | 2.1 mΩ |
Nominal Vgs | 1.8 V |
Height | 810μm |
Length | 5mm |
Width | 6mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerVDFN |
Number of Pins | 8 |
Supplier Device Package | PQFN (5x6) Single Die |
Operating Temperature | -55°C~150°C TJ |
Packaging | Cut Tape (CT) |
Published | 2009 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 3.6W |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Element Configuration | Single |
Power Dissipation | 100W |
Turn On Delay Time | 18 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 2.1mOhm @ 50A, 10V |