Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Power Dissipation-Max | 3.6W Ta 104W Tc |
Element Configuration | Single |
Power Dissipation | 3.6W |
Turn On Delay Time | 9.1 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 8.5m Ω @ 45A, 10V |
Vgs(th) (Max) @ Id | 4V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 3110pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 14A Ta 75A Tc |
Gate Charge (Qg) (Max) @ Vgs | 72nC @ 10V |
Rise Time | 12ns |
Drain to Source Voltage (Vdss) | 75V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 6.5 ns |
Turn-Off Delay Time | 20 ns |
Continuous Drain Current (ID) | 14A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 75A |
Height | 1.17mm |
Length | 5.85mm |
Width | 5mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |