Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Resistance | 92mOhm |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | S-PDSO-F5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.8W Ta 29W Tc |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 115m Ω @ 6.3A, 10V |
Vgs(th) (Max) @ Id | 4V @ 35μA |
Input Capacitance (Ciss) (Max) @ Vds | 760pF @ 50V |
Current - Continuous Drain (Id) @ 25°C | 3.2A Ta 20A Tc |
Gate Charge (Qg) (Max) @ Vgs | 26nC @ 10V |
Drain to Source Voltage (Vdss) | 100V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Continuous Drain Current (ID) | 20A |
Threshold Voltage | 4V |
Drain Current-Max (Abs) (ID) | 3.2A |
Pulsed Drain Current-Max (IDM) | 36A |
DS Breakdown Voltage-Min | 100V |
Avalanche Energy Rating (Eas) | 41 mJ |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |