Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Base Part Number | IRFHM4231 |
JESD-30 Code | S-PDSO-N5 |
Number of Elements | 1 |
Power Dissipation-Max | 2.7W Ta 29W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 8.7 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.4m Ω @ 30A, 10V |
Vgs(th) (Max) @ Id | 2.1V @ 35μA |
Input Capacitance (Ciss) (Max) @ Vds | 1270pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 40A Tc |
Gate Charge (Qg) (Max) @ Vgs | 20nC @ 10V |
Rise Time | 28ns |
Drain to Source Voltage (Vdss) | 25V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 5.9 ns |
Turn-Off Delay Time | 12 ns |
Continuous Drain Current (ID) | 22A |
Threshold Voltage | 1.6V |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.0046Ohm |
DS Breakdown Voltage-Min | 25V |
Avalanche Energy Rating (Eas) | 42 mJ |
Height | 900μm |
Length | 3.3mm |
Width | 5mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |