Parameters | |
---|---|
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-TQFN Exposed Pad |
Number of Pins | 5 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | FASTIRFET™, HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Resistance | 4.4MOhm |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Number of Elements | 1 |
Power Dissipation-Max | 2.8W Ta 28W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.8W |
Case Connection | DRAIN |
Turn On Delay Time | 7.8 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 4.4m Ω @ 30A, 10V |
Vgs(th) (Max) @ Id | 2.1V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds | 1011pF @ 13V |
Current - Continuous Drain (Id) @ 25°C | 20A Ta |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 10V |
Rise Time | 30ns |
Drain to Source Voltage (Vdss) | 25V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 5.3 ns |
Turn-Off Delay Time | 8 ns |
Continuous Drain Current (ID) | 20A |
Threshold Voltage | 1.6V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 63A |
Pulsed Drain Current-Max (IDM) | 270A |
Avalanche Energy Rating (Eas) | 39 mJ |
Height | 900μm |
Length | 3.3mm |
Width | 3.3mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |