Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Resistance | 4.2mOhm |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | FLAT |
JESD-30 Code | S-PDSO-F5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Number of Channels | 1 |
Power Dissipation-Max | 2.8W Ta 34W Tc |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 11 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 5.2m Ω @ 20A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds | 1667pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 19A Ta |
Gate Charge (Qg) (Max) @ Vgs | 18nC @ 10V |
Rise Time | 22ns |
Drain to Source Voltage (Vdss) | 25V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 6.2 ns |
Turn-Off Delay Time | 13 ns |
Continuous Drain Current (ID) | 19A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 65A |
Pulsed Drain Current-Max (IDM) | 260A |
DS Breakdown Voltage-Min | 25V |
Avalanche Energy Rating (Eas) | 50 mJ |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |