Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-VQFN Exposed Pad |
Number of Pins | 8 |
Packaging | Cut Tape (CT) |
Published | 2005 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 2.7W |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Power Dissipation | 37W |
Turn On Delay Time | 12 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 3.8m Ω @ 20A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds | 2155pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 21A Ta 40A Tc |
Gate Charge (Qg) (Max) @ Vgs | 31nC @ 10V |
Rise Time | 25ns |
Fall Time (Typ) | 9.2 ns |
Turn-Off Delay Time | 13 ns |
Continuous Drain Current (ID) | 21A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Recovery Time | 26 ns |
Nominal Vgs | 1.8 V |
Height | 990.6μm |
Length | 3.2766mm |
Width | 3.3mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |