Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2010 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Resistance | 12.6MOhm |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
JESD-30 Code | S-PDSO-N5 |
Number of Elements | 1 |
Power Dissipation-Max | 2.5W Ta 27W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Case Connection | DRAIN |
Turn On Delay Time | 6.9 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 7.8m Ω @ 12A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds | 1050pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 14A Ta 40A Tc |
Gate Charge (Qg) (Max) @ Vgs | 16nC @ 10V |
Rise Time | 12ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 4.7 ns |
Turn-Off Delay Time | 6.2 ns |
Continuous Drain Current (ID) | 14A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 40A |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 96A |
Avalanche Energy Rating (Eas) | 50 mJ |
Nominal Vgs | 1.8 V |
Height | 990.6μm |
Length | 3.2766mm |
Width | 3.3mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |