Parameters | |
---|---|
Length | 15.87mm |
Width | 5.3086mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Lead Free | Contains Lead, Lead Free |
Contact Plating | Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-247-3 |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Published | 2004 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | Through Hole |
ECCN Code | EAR99 |
Resistance | 4.5MOhm |
Additional Feature | AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
Voltage - Rated DC | 75V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 209A |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 470W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 470W |
Case Connection | DRAIN |
Turn On Delay Time | 23 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 4.5m Ω @ 125A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 13000pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 209A Tc |
Gate Charge (Qg) (Max) @ Vgs | 620nC @ 10V |
Rise Time | 190ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 130 ns |
Turn-Off Delay Time | 130 ns |
Continuous Drain Current (ID) | 209A |
Threshold Voltage | 4V |
JEDEC-95 Code | TO-247AC |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 90A |
Drain to Source Breakdown Voltage | 75V |
Pulsed Drain Current-Max (IDM) | 840A |
Dual Supply Voltage | 75V |
Recovery Time | 210 ns |
Max Junction Temperature (Tj) | 175°C |
Nominal Vgs | 4 V |
Height | 24.99mm |