Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-274AA |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Bulk |
Published | 2002 |
Series | HEXFET® |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Resistance | 9Ohm |
Additional Feature | AVALANCHE RATED, HIGH RELIABILITY |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 100V |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Current Rating | 170A |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Power Dissipation-Max | 580W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 441W |
Case Connection | DRAIN |
Turn On Delay Time | 24 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 9m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id | 5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 6790pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 170A Tc |
Gate Charge (Qg) (Max) @ Vgs | 390nC @ 10V |
Rise Time | 270ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±30V |
Fall Time (Typ) | 140 ns |
Turn-Off Delay Time | 45 ns |
Continuous Drain Current (ID) | 170A |
Gate to Source Voltage (Vgs) | 30V |
Drain to Source Breakdown Voltage | 100V |
Pulsed Drain Current-Max (IDM) | 670A |
Dual Supply Voltage | 100V |
Recovery Time | 330 ns |
Nominal Vgs | 5 V |
Height | 20.8mm |
Length | 16.0782mm |
Width | 5.3mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead, Lead Free |