Parameters | |
---|---|
Drain-source On Resistance-Max | 0.0065Ohm |
Pulsed Drain Current-Max (IDM) | 340A |
Terminal Form | GULL WING |
DS Breakdown Voltage-Min | 30V |
Avalanche Energy Rating (Eas) | 100 mJ |
Peak Reflow Temperature (Cel) | 260 |
RoHS Status | ROHS3 Compliant |
Reach Compliance Code | not_compliant |
Factory Lead Time | 1 Week |
Time@Peak Reflow Temperature-Max (s) | 30 |
Mounting Type | Surface Mount |
JESD-30 Code | R-PSSO-G2 |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Qualification Status | Not Qualified |
Surface Mount | YES |
Number of Elements | 1 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Configuration | SINGLE WITH BUILT-IN DIODE |
Packaging | Tape & Reel (TR) |
Power Dissipation-Max | 79W Tc |
Published | 2004 |
Series | HEXFET® |
Operating Mode | ENHANCEMENT MODE |
JESD-609 Code | e3 |
Case Connection | DRAIN |
Part Status | Active |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Rds On (Max) @ Id, Vgs | 6.5m Ω @ 15A, 10V |
Number of Terminations | 2 |
Vgs(th) (Max) @ Id | 2.25V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2330pF @ 15V |
ECCN Code | EAR99 |
Current - Continuous Drain (Id) @ 25°C | 86A Tc |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Gate Charge (Qg) (Max) @ Vgs | 26nC @ 4.5V |
Drain to Source Voltage (Vdss) | 30V |
Technology | MOSFET (Metal Oxide) |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Terminal Position | SINGLE |
Vgs (Max) | ±20V |
JEDEC-95 Code | TO-252AA |
Drain Current-Max (Abs) (ID) | 30A |