Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2000 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Voltage - Rated DC | 200V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Current Rating | 31A |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Configuration | SINGLE |
Power Dissipation-Max | 3.1W Ta 200W Tc |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 82m Ω @ 18A, 10V |
Vgs(th) (Max) @ Id | 5.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2370pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 31A Tc |
Gate Charge (Qg) (Max) @ Vgs | 110nC @ 10V |
Rise Time | 38ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±30V |
Continuous Drain Current (ID) | 31A |
Drain-source On Resistance-Max | 0.082Ohm |
Pulsed Drain Current-Max (IDM) | 124A |
Avalanche Energy Rating (Eas) | 420 mJ |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |