Parameters | |
---|---|
Vgs (Max) | ±30V |
Fall Time (Typ) | 10 ns |
Turn-Off Delay Time | 23 ns |
Continuous Drain Current (ID) | 31A |
Threshold Voltage | 5.5V |
Gate to Source Voltage (Vgs) | 30V |
Drain to Source Breakdown Voltage | 200V |
Dual Supply Voltage | 200V |
Avalanche Energy Rating (Eas) | 420 mJ |
Nominal Vgs | 5.5 V |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Height | 4.826mm |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Length | 10.668mm |
Number of Pins | 3 |
Width | 9.65mm |
Transistor Element Material | SILICON |
Radiation Hardening | No |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2000 |
REACH SVHC | No SVHC |
Series | HEXFET® |
RoHS Status | ROHS3 Compliant |
Part Status | Not For New Designs |
Lead Free | Lead Free |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Resistance | 82mOhm |
Voltage - Rated DC | 200V |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Current Rating | 31A |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 3.1W Ta 200W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 200W |
Case Connection | DRAIN |
Turn On Delay Time | 13 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 82m Ω @ 18A, 10V |
Vgs(th) (Max) @ Id | 5.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2370pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 31A Tc |
Gate Charge (Qg) (Max) @ Vgs | 107nC @ 10V |
Rise Time | 38ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |