Parameters | |
---|---|
Current - Continuous Drain (Id) @ 25°C | 80A Tc |
Gate Charge (Qg) (Max) @ Vgs | 84nC @ 10V |
Rise Time | 110ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Vgs (Max) | ±20V |
Mounting Type | Surface Mount |
Fall Time (Typ) | 96 ns |
Turn-Off Delay Time | 43 ns |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Continuous Drain Current (ID) | 80A |
Gate to Source Voltage (Vgs) | 20V |
Number of Pins | 3 |
Drain-source On Resistance-Max | 0.009Ohm |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Drain to Source Breakdown Voltage | 75V |
Height | 4.826mm |
Packaging | Tape & Reel (TR) |
Length | 10.668mm |
Published | 2012 |
Width | 9.65mm |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PSSO-G2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Power Dissipation-Max | 140W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 140W |
Case Connection | DRAIN |
Turn On Delay Time | 16 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 9m Ω @ 46A, 10V |
Vgs(th) (Max) @ Id | 4V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 3070pF @ 50V |