Parameters | |
---|---|
Published | 2011 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Resistance | 11.8MOhm |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 375W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 375W |
Case Connection | DRAIN |
Turn On Delay Time | 18 ns |
Factory Lead Time | 1 Week |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Mount | Surface Mount |
Rds On (Max) @ Id, Vgs | 12.1m Ω @ 62A, 10V |
Mounting Type | Surface Mount |
Vgs(th) (Max) @ Id | 5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 5270pF @ 50V |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Current - Continuous Drain (Id) @ 25°C | 195A Tc |
Gate Charge (Qg) (Max) @ Vgs | 120nC @ 10V |
Rise Time | 73ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Number of Pins | 3 |
Vgs (Max) | ±20V |
Fall Time (Typ) | 39 ns |
Transistor Element Material | SILICON |
Turn-Off Delay Time | 41 ns |
Continuous Drain Current (ID) | 195A |
Operating Temperature | -55°C~175°C TJ |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 99A |
Drain to Source Breakdown Voltage | 150V |
Height | 4.826mm |
Length | 10.668mm |
Width | 9.652mm |
Packaging | Tape & Reel (TR) |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |