Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2010 |
Series | HEXFET® |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Power Dissipation-Max | 3.8W Ta 230W Tc |
Element Configuration | Single |
Power Dissipation | 3.8W |
Turn On Delay Time | 16 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 32m Ω @ 36A, 10V |
Vgs(th) (Max) @ Id | 5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2770pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 51A Tc |
Gate Charge (Qg) (Max) @ Vgs | 89nC @ 10V |
Rise Time | 47ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±30V |
Fall Time (Typ) | 25 ns |
Turn-Off Delay Time | 28 ns |
Continuous Drain Current (ID) | 51A |
Gate to Source Voltage (Vgs) | 30V |
Drain to Source Breakdown Voltage | 150V |
Height | 4.826mm |
Length | 10.668mm |
Width | 9.65mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |