Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Weight | 3.949996g |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2009 |
Series | HEXFET®, StrongIRFET™ |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 125W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 11 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 8.4m Ω @ 46A, 10V |
Vgs(th) (Max) @ Id | 3.7V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 4020pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 76A Tc |
Gate Charge (Qg) (Max) @ Vgs | 109nC @ 10V |
Rise Time | 48ns |
Drain to Source Voltage (Vdss) | 75V |
Drive Voltage (Max Rds On,Min Rds On) | 6V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 39 ns |
Turn-Off Delay Time | 51 ns |
Continuous Drain Current (ID) | 76A |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.0084Ohm |
Pulsed Drain Current-Max (IDM) | 280A |
DS Breakdown Voltage-Min | 75V |
Avalanche Energy Rating (Eas) | 209 mJ |
Height | 4.83mm |
Length | 10.67mm |
Width | 9.65mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |