Parameters | |
---|---|
Vgs (Max) | ±20V |
Fall Time (Typ) | 8.2 ns |
Turn-Off Delay Time | 9.1 ns |
Continuous Drain Current (ID) | 8.2A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 80A |
Recovery Time | 12 ns |
Nominal Vgs | 1.8 V |
Height | 1.3mm |
Length | 3mm |
Width | 1.75mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOT-23-6 |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2008 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Resistance | 19MOhm |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Number of Elements | 1 |
Power Dissipation-Max | 2W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2W |
Turn On Delay Time | 7.3 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 19m Ω @ 8.2A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds | 560pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 8.2A Ta |
Gate Charge (Qg) (Max) @ Vgs | 4.8nC @ 4.5V |
Rise Time | 15ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |