Parameters | |
---|---|
Power Dissipation | 110W |
Case Connection | DRAIN |
Turn On Delay Time | 12 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 39m Ω @ 18A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1690pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 31A Tc |
Factory Lead Time | 1 Week |
Mount | Through Hole |
Gate Charge (Qg) (Max) @ Vgs | 56nC @ 10V |
Mounting Type | Through Hole |
Rise Time | 27ns |
Package / Case | TO-251-3 Short Leads, IPak, TO-251AA |
Number of Pins | 3 |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Transistor Element Material | SILICON |
Vgs (Max) | ±20V |
Operating Temperature | -55°C~175°C TJ |
Fall Time (Typ) | 13 ns |
Packaging | Tube |
Published | 2004 |
Turn-Off Delay Time | 40 ns |
Series | HEXFET® |
Continuous Drain Current (ID) | 31A |
JESD-609 Code | e3 |
Part Status | Active |
Threshold Voltage | 4V |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Gate to Source Voltage (Vgs) | 20V |
Number of Terminations | 3 |
Drain to Source Breakdown Voltage | 100V |
ECCN Code | EAR99 |
Dual Supply Voltage | 100V |
Resistance | 39Ohm |
Nominal Vgs | 4 V |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Height | 6.22mm |
Subcategory | FET General Purpose Power |
Length | 6.7056mm |
Voltage - Rated DC | 100V |
Width | 2.3876mm |
Technology | MOSFET (Metal Oxide) |
Radiation Hardening | No |
Terminal Position | SINGLE |
REACH SVHC | No SVHC |
Peak Reflow Temperature (Cel) | 260 |
RoHS Status | ROHS3 Compliant |
Current Rating | 31A |
Lead Free | Lead Free |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 3W Ta 110W Tc |
Operating Mode | ENHANCEMENT MODE |