Parameters | |
---|---|
Power Dissipation | 110W |
Case Connection | DRAIN |
Turn On Delay Time | 14 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 295m Ω @ 6.6A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 860pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 13A Tc |
Gate Charge (Qg) (Max) @ Vgs | 66nC @ 10V |
Rise Time | 36ns |
Factory Lead Time | 1 Week |
Drain to Source Voltage (Vdss) | 150V |
Mount | Through Hole |
Mounting Type | Through Hole |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Package / Case | TO-251-3 Short Leads, IPak, TO-251AA |
Number of Pins | 3 |
Vgs (Max) | ±20V |
Transistor Element Material | SILICON |
Fall Time (Typ) | 37 ns |
Operating Temperature | -55°C~175°C TJ |
Turn-Off Delay Time | 53 ns |
Packaging | Tube |
Published | 2004 |
Continuous Drain Current (ID) | -13A |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Threshold Voltage | -4V |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | -150V |
Resistance | 580MOhm |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Pulsed Drain Current-Max (IDM) | 44A |
Additional Feature | AVALANCHE RATED |
Dual Supply Voltage | -150V |
Subcategory | Other Transistors |
Nominal Vgs | -4 V |
Voltage - Rated DC | -150V |
Height | 6.22mm |
Technology | MOSFET (Metal Oxide) |
Length | 6.7056mm |
Peak Reflow Temperature (Cel) | 260 |
Width | 2.3876mm |
Current Rating | -13A |
Time@Peak Reflow Temperature-Max (s) | 30 |
Radiation Hardening | No |
REACH SVHC | No SVHC |
Number of Elements | 1 |
Power Dissipation-Max | 110W Tc |
RoHS Status | ROHS3 Compliant |
Element Configuration | Single |
Lead Free | Contains Lead, Lead Free |
Operating Mode | ENHANCEMENT MODE |