Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric ME |
Number of Pins | 2 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFET®, StrongIRFET™ |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-N6 |
Number of Elements | 1 |
Power Dissipation-Max | 104W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 35 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 1.25m Ω @ 123A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 6904pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 209A Tc |
Gate Charge (Qg) (Max) @ Vgs | 111nC @ 4.5V |
Drain to Source Voltage (Vdss) | 40V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Turn-Off Delay Time | 54 ns |
Continuous Drain Current (ID) | 209A |
Threshold Voltage | 1.8V |
Gate to Source Voltage (Vgs) | 20V |
Pulsed Drain Current-Max (IDM) | 836A |
DS Breakdown Voltage-Min | 40V |
Avalanche Energy Rating (Eas) | 190 mJ |
Height | 700μm |
Length | 6.35mm |
Width | 5.05mm |
REACH SVHC | Unknown |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |