Parameters | |
---|---|
Vgs(th) (Max) @ Id | 2.5V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 4730pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 29A Ta 100A Tc |
Factory Lead Time | 1 Week |
Gate Charge (Qg) (Max) @ Vgs | 82nC @ 10V |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Rise Time | 54ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Package / Case | 8-PowerVDFN |
Number of Pins | 8 |
Fall Time (Typ) | 21 ns |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Turn-Off Delay Time | 31 ns |
Packaging | Tape & Reel (TR) |
Published | 2010 |
Continuous Drain Current (ID) | 100A |
Series | HEXFET® |
Gate to Source Voltage (Vgs) | 16V |
JESD-609 Code | e3 |
Drain Current-Max (Abs) (ID) | 29A |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Drain to Source Breakdown Voltage | 40V |
Number of Terminations | 5 |
Pulsed Drain Current-Max (IDM) | 400A |
ECCN Code | EAR99 |
Avalanche Energy Rating (Eas) | 360 mJ |
Height | 990.6μm |
Resistance | 3.2MOhm |
Length | 6.1468mm |
Terminal Finish | Matte Tin (Sn) |
Width | 5.15mm |
Additional Feature | HIGH RELIABILITY |
Radiation Hardening | No |
Subcategory | FET General Purpose Power |
RoHS Status | ROHS3 Compliant |
Technology | MOSFET (Metal Oxide) |
Lead Free | Lead Free |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PDSO-N5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 3.6W Ta 156W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 156W |
Case Connection | DRAIN |
Turn On Delay Time | 21 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 2.4m Ω @ 50A, 10V |