Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Configuration | Single |
Power Dissipation-Max | 3.6W Ta 52W Tc |
Power Dissipation | 3.6W |
Turn On Delay Time | 9.4 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 3m Ω @ 20A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds | 3710pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 28A Ta 105A Tc |
Gate Charge (Qg) (Max) @ Vgs | 86nC @ 10V |
Rise Time | 23ns |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 36 ns |
Turn-Off Delay Time | 67 ns |
Continuous Drain Current (ID) | 28A |
Threshold Voltage | 800mV |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | 20V |
Nominal Vgs | 800 mV |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |