Parameters | |
---|---|
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-PowerVDFN |
Number of Pins | 6 |
Supplier Device Package | 6-PQFN (2x2) |
Packaging | Cut Tape (CT) |
Published | 2011 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Max Power Dissipation | 2.1W |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Element Configuration | Single |
Power Dissipation | 2.1W |
Turn On Delay Time | 7.9 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 31mOhm @ 8.5A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 10μA |
Input Capacitance (Ciss) (Max) @ Vds | 877pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 7.2A Ta 15A Tc |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 10V |
Rise Time | 54ns |
Drain to Source Voltage (Vdss) | 20V |
Fall Time (Typ) | 66 ns |
Turn-Off Delay Time | 54 ns |
Continuous Drain Current (ID) | 7.2A |
Threshold Voltage | -800mV |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | -20V |
Input Capacitance | 870pF |
Recovery Time | 41 ns |
Drain to Source Resistance | 31mOhm |
Rds On Max | 31 mΩ |
Nominal Vgs | -800 mV |
Height | 950μm |
Length | 2.1mm |
Width | 2.1mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |