Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-PowerVDFN |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2004 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Resistance | 31MOhm |
Terminal Finish | Matte Tin (Sn) |
Subcategory | Other Transistors |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.1W Ta 9.6W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 9.6W |
Turn On Delay Time | 7.9 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 31m Ω @ 8.5A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 10μA |
Input Capacitance (Ciss) (Max) @ Vds | 877pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 7.2A Ta 15A Tc |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 10V |
Rise Time | 54ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 66 ns |
Turn-Off Delay Time | 54 ns |
Continuous Drain Current (ID) | 7.2A |
Threshold Voltage | -800mV |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | -20V |
Pulsed Drain Current-Max (IDM) | 34A |
Nominal Vgs | -800 mV |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |