Parameters | |
---|---|
Current - Continuous Drain (Id) @ 25°C | 10A Ta 12A Tc |
Gate Charge (Qg) (Max) @ Vgs | 14nC @ 4.5V |
Rise Time | 15ns |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 13 ns |
Turn-Off Delay Time | 19 ns |
Continuous Drain Current (ID) | 10A |
Threshold Voltage | 800mV |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | 20V |
Pulsed Drain Current-Max (IDM) | 88A |
Nominal Vgs | 800 mV |
Height | 950μm |
Length | 2.1mm |
Width | 2.1mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-PowerVDFN |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Number of Elements | 1 |
Power Dissipation-Max | 1.98W Ta 9.6W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 9.6W |
Case Connection | DRAIN |
Turn On Delay Time | 5.8 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 11.7m Ω @ 8.5A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 10μA |
Input Capacitance (Ciss) (Max) @ Vds | 1110pF @ 10V |