Parameters | |
---|---|
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | HIGH RELIABILITY |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PDSO-G3 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 150°C |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Operating Mode | ENHANCEMENT MODE |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 45m Ω @ 4.2A, 4.5V |
Vgs(th) (Max) @ Id | 1.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 740pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 4.2A Ta |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 5V |
Drain to Source Voltage (Vdss) | 20V |
JEDEC-95 Code | TO-236AB |
Drain Current-Max (Abs) (ID) | 4.2A |
Drain-source On Resistance-Max | 0.045Ohm |
Pulsed Drain Current-Max (IDM) | 33A |
DS Breakdown Voltage-Min | 20V |
Power Dissipation-Max (Abs) | 1.25W |
RoHS Status | Non-RoHS Compliant |
Mounting Type | Surface Mount |
Package / Case | TO-236-3, SC-59, SOT-23-3 |
Surface Mount | YES |
Transistor Element Material | SILICON |
Packaging | Cut Tape (CT) |
Published | 2003 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |