Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-236-3, SC-59, SOT-23-3 |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Manufacturer Package Identifier | Micro3 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2007 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 600mOhm |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Subcategory | Other Transistors |
Voltage - Rated DC | -20V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | -620mA |
Number of Elements | 1 |
Power Dissipation-Max | 540mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 540mW |
Turn On Delay Time | 13 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 600m Ω @ 610mA, 4.5V |
Vgs(th) (Max) @ Id | 1.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 97pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 780mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 3.6nC @ 4.45V |
Rise Time | 18ns |
Drive Voltage (Max Rds On,Min Rds On) | 2.7V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 22 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | -780mA |
Threshold Voltage | -1.5V |
Gate to Source Voltage (Vgs) | 12V |
Drain Current-Max (Abs) (ID) | 0.78A |
Drain to Source Breakdown Voltage | -20V |
Dual Supply Voltage | -20V |
Nominal Vgs | -1.5 V |
Min Breakdown Voltage | 20V |
Height | 1.016mm |
Length | 3.0226mm |
Width | 1.397mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |