Parameters | |
---|---|
Current - Continuous Drain (Id) @ 25°C | 3.2A Ta |
Packaging | Tape & Reel (TR) |
Gate Charge (Qg) (Max) @ Vgs | 9.6nC @ 10V |
Published | 2004 |
Rise Time | 4.4ns |
Series | HEXFET® |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
JESD-609 Code | e3 |
Vgs (Max) | ±20V |
Fall Time (Typ) | 2 ns |
Part Status | Active |
Turn-Off Delay Time | 10 ns |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Reverse Recovery Time | 36 ns |
Number of Terminations | 6 |
Continuous Drain Current (ID) | 3.2A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 20V |
Termination | SMD/SMT |
Drain to Source Breakdown Voltage | 30V |
Nominal Vgs | 1 V |
ECCN Code | EAR99 |
Height | 1.143mm |
Length | 2.9972mm |
Resistance | 100mOhm |
Width | 1.75mm |
Additional Feature | ULTRA LOW RESISTANCE |
REACH SVHC | No SVHC |
Voltage - Rated DC | 30V |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Current Rating | 3.2A |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Number of Elements | 1 |
Factory Lead Time | 1 Week |
Power Dissipation-Max | 1.7W Ta |
Contact Plating | Tin |
Element Configuration | Single |
Mount | Surface Mount |
Operating Mode | ENHANCEMENT MODE |
Mounting Type | Surface Mount |
Power Dissipation | 1.7W |
Turn On Delay Time | 4.6 ns |
Package / Case | SOT-23-6 |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Number of Pins | 6 |
Rds On (Max) @ Id, Vgs | 100m Ω @ 2.2A, 10V |
Transistor Element Material | SILICON |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 210pF @ 25V |
Operating Temperature | -55°C~150°C TJ |