Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOT-23-6 |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1997 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 180mOhm |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | ULTRA LOW RESISTANCE |
Voltage - Rated DC | -30V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | -2.3A |
Number of Elements | 1 |
Power Dissipation-Max | 1.7W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.7W |
Turn On Delay Time | 10 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 180m Ω @ 1.6A, 10V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 170pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 2.4A Ta |
Gate Charge (Qg) (Max) @ Vgs | 11nC @ 10V |
Rise Time | 12ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 8.4 ns |
Turn-Off Delay Time | 20 ns |
Continuous Drain Current (ID) | -2.3A |
Threshold Voltage | -1V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 2.4A |
Drain to Source Breakdown Voltage | -30V |
Dual Supply Voltage | -30V |
Nominal Vgs | -1 V |
Height | 1.4478mm |
Length | 2.9972mm |
Width | 1.75mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |