Parameters | |
---|---|
Threshold Voltage | -700mV |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | -20V |
Height | 1.4478mm |
Length | 2.9972mm |
Width | 1.75mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOT-23-6 |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1997 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Resistance | 200mOhm |
Terminal Finish | Matte Tin (Sn) |
Voltage - Rated DC | -20V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | -2.3A |
Number of Elements | 1 |
Power Dissipation-Max | 1.7W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.7W |
Turn On Delay Time | 13 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 200m Ω @ 1.6A, 4.5V |
Vgs(th) (Max) @ Id | 700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 210pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 2.4A Ta |
Gate Charge (Qg) (Max) @ Vgs | 8.8nC @ 4.5V |
Rise Time | 20ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 2.7V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 18 ns |
Turn-Off Delay Time | 21 ns |
Continuous Drain Current (ID) | -2.4A |